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HSPA 3.5G 3G Modem Module

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HSPA 3.5G 3G Modem Module

Brand Name : CINTERION

Model Number : EHS6

Certification : CE,ROHS,

Place of Origin : Germany

MOQ : 10pcs

Price : 35$/pcs

Payment Terms : T/T, Western Union,paypal

Supply Ability : 5000pcs/month

Delivery Time : 3-5 days

Packaging Details : standard package depends on CINTERION

Product name : 3G module

frequency : Five-Band 3G (HSPA)

Operating Temperature : -40°C to +90°C

size : 27.6 x 25.4 x 2.3 mm

Weight : 3g

Form Factor : LGA

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HSPA 3.5G 3G Modem Module

HSPA 3G 3.5G Five-Band cinterion EHS6 gps embedded m2m module


Brief Descriptions of Cinterion EGS6:

· Five-Band 3G (HSPA)

· Ultra-compact LGA

· Java ME 3.2

· Integrated FOTA

· Secure TCP/IP

· Extended operating temperature range: -40° to +90°C


Product Description



The flagship Cinterion® EHS6 is the 5th generation of Gemalto M2M’s Java embedded machine-to-machine (M2M) modules, which have simplified highly efficient, end-to-end industrial communication for the last decade.
The tiny EHS6 module offers the latest Java ME 3.2 client runtime platform optimized for resource-constrained M2M applications. It significantly reduces total cost of ownership (TCO) and time to market by sharing internal resources such as memory, a large existing code base and proven software building blocks.
The improved Java concept uses Multi MIDlet Java execution to simultaneously host and run multiple applications and protocols. An extended security concept with the latest TLS/SSL engine provides secure and reliable TCP/IP connectivity while an enriched internal flash file system enables royalty free firmware updates over-the-air (FOTA) when required. Sophisticated sandbox models and layered architectures simplify device management (DM) and separate mobile network operator approvals from application code development allowing simultaneous progress of both phases for a shorter time to market.
Providing the capability for multiple designs from one solution, EHS6 is an ideal module for M2M applications migrating from 2G to 3G that require cost efficiency along with global connectivity. EHS6 offers five band HSPA to support high bandwidth connectivity, enabling speeds up to 7.2 Mbps in downlink and 5.7 Mbps in uplink and rounds out the existing portfolio comprised of the Industrial Platform.


Functions


Cinterion EHS6 GENERAL FEATURES

General Features:

> 3GPP Rel.7 Compliant Protocol Stack
> Five Bands UMTS (WCDMA/FDD)
Bands: 800, 850, 900, 1900 and 2100 MHz
> Quad-Band GSM
Bands: 850, 900, 1800 and 1900 MHz
> SIM Application Toolkit, Class 3,
with BIP and RunAT support
> Embedded IP stack
> Control via standardized and extended
AT commands (Hayes, TS 27.007 and 27.005)
> TCP/IP stack access via AT command and
transparent TCP services
> Secure Connection for client IP services
> Internet Services TCP/UDP server/client, DNS, Ping,
FTP client, HTTP client
> Supply voltage range 3.1 - 4.5 V, highly optimized
for minimal power consumption. (Baseband) Supply
voltage range 2.8 - 4.5 V (RF-PA)
> Dimension: 27.6 x 25.4 x 2.3 mm
> Weight: 3 g
> Operating Temperature: -40 °C to +90 °C


Specifications:

> HSDPA Cat.8 / HSUPA Cat.6 data rates
DL: max. 7.2 Mbps, UL: max. 5.76 Mbps
> EDGE Class 12 data rates
DL: max. 237 kbps, UL: max. 237 kbps
> GPRS Class 12 data rates
DL: max. 85.6 kbps, UL: max. 85.6 kbps
> EU eCall and ERA/GLONASS support
> CSD data transmission up to 9.6 kbps, V.110,
non-transparent
> SMS text and PDU mode support
> High quality voice support for handset, headset and
hands-free operation
> Integrated TTY modem
> Speech codec: FR, HR, EFR and AMR


Specifical Features:

> USB interface supports multiple composite modes
and a Linux-/Mac- compliant mode
> Firmware update via USB and serial interface
> Real time clock with alarm functionality
> Multiplexer according 3GPP TS 27.010
> RLS Monitoring (Jamming detection) in 2G and 3G
> Informal Network Scan
> Customer IMEI/SIM-Lock as variant
> Integrated FOTA, configurable and free of charge


JAVA OPEN PLATFORM

> Java™ ME 3.2
> Secure data transmission with HTTPS/SSL
> Pad for GSM/WCDMA Antenna
> USB 2.0 HS interface up to 480 Mbps
> High speed serial modem interface ASC0
> HSIC HS interface up to 480 Mbps
> 16 GPIO lines shared with DSR, DTR, DCD (all ASC0),
> ASC1 (RXD, TXD, RTS, CTS), SPI, Fast-Shutdown,
> Network-Status-Indication
> Multi-Threading programming and Multi-Application
execution
> 10 MB RAM and 10 MB Flash File System




Interface (LGA PADS)

> ADC and I2C interface
> 4-wire high speed serial interfaces ASC1
> Digital audio interface (analog audio optional)
> UICC and U/SIM card interface 1.8 V / 3 V
> Lines for Module-On and Reset




Detailed Images
HSPA 3.5G 3G Modem Module


HSPA 3.5G 3G Modem Module



Module show:
HSPA 3.5G 3G Modem Module





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